Thermal Performance of Ricehusk-Sawdust-Waste Carton Fibers Insulation Boards
DOI:
https://doi.org/10.33003/fjs-2026-1021-6300Keywords:
Thermal Insulation Boards, Rice Husks, Sawdust, Carton Fibers, Thermal Conductivity, Thermal ResistanceAbstract
This study evaluated the thermal performance of insulation boards produced from rice husks, sawdust, carton fibers and polyvinyl acetate (PVA) adhesive, focusing on thermal conductivity and thermal resistance. A true experimental research design was adopted to produce four formulations: A (5:3:2:1), B (4:4:2:1), C (3:5:2:1) and D (6:2:2:1), with five specimens per formulation, giving 20 specimens. Laboratory testing was conducted to determine their thermal properties. Data were analysed using mean, standard deviation, one-way analysis of variance (ANOVA) and Tukey’s honestly significant difference post hoc test. The results showed mean thermal conductivity values of 0.52, 0.48, 0.39 and 0.50 W/m·K for formulations A, B, C and D, respectively, with an overall mean of 0.47 W/m·K. Formulation C recorded the lowest mean thermal conductivity and was the only formulation within the study-adopted evaluation range of 0.30–0.40 W/m·K. ANOVA revealed a statistically significant difference in thermal conductivity, F (3,16) = 8.164, p = .002. The reported mean thermal resistance values were 3.03, 3.36, 4.08 and 3.15 m·K/W for formulations A, B, C and D, respectively, with an overall mean of 3.41 m·K/W. ANOVA also indicated a statistically significant difference in thermal resistance, F(3,16) = 7.860, p = .002. However, the thermal resistance values require verification against the original specimen measurements and thickness calculations. ASTM C518 provides a method for measuring thermal transmission properties, while ASTM C208 is considered only a reference benchmark because the applicability of its scope to the composite boards.
References
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Copyright (c) 2026 Ibobee Isaac Hime, Daniel Momngu Tiough
This work is licensed under a Creative Commons Attribution 4.0 International License.
